In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturisation and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators or drives (mechatronic integration).
The International Conference on Integrated Power Electronics Systems (CIPS) was consequently focused on the following main aspects, which are today more important than ever
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems' and components' operational behaviour and reliability
to increase functionality, energy efficiency and system reliability while decreasing cost.Basic technologies for integrated power electronic systems as well as upcoming new important applications were presented in interdisciplinary invited papers.
The conference has been co-organised by the expert group Power Electronics and System Integration (Q1) within VDE ETG and the European Center for Power Electronics (ECPE). General Chairs were Leo Lorenz, ECPE e.V., and Thomas Harder, ECPE e.V. while Andreas Lindemann, Otto von Guericke University Magdeburg and Nando Kaminski, University of Bremen served as Technical Chairs.
The physical part of the conference in 2020 regrettably had to be cancelled shortly prior to the scheduled dates 24 -26 March because of the current pandemic situation in Berlin. At least, a chat forum on the uploaded papers took place and the traditional content-rich proceedings with all published contributions are available as ETG-Fachbericht 161.
