CIPS 2024 Düsseldorf: A Dynamic Fusion of Keynotes, Invited Speakers, and Exhibitions in Power Electronics System Integration
The CIPS 2024 event in Düsseldorf not only featured enlightening keynote addresses and insightful presentations from Invited Speakers but also housed a vibrant exhibition, creating a holistic experience for attendees. The exhibition served as a hub for showcasing new products, services, and fostering specialized discussions.
Prof. Rik W. De Doncker's keynote on "Integrated Packaging of Wide Bandgap Power Devices for Ultra-high Power Density DC Converters" set the tone for the event, providing a visionary outlook on pushing the boundaries of power density. Francesco Iannuzzo's keynote, "Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?" engaged the audience in discussions about the challenges and opportunities in adopting silicon carbide in automotive applications.
Beyond the keynote sessions, the 10 Invited Speakers added depth and diversity to the discourse, covering a spectrum of topics such as advanced materials, emerging technologies, and innovative design approaches in power electronics system integration. This curated selection of presentations enriched the overall experience, offering attendees a comprehensive understanding of the field's current landscape and future directions.
Complementing the enlightening sessions was the exhibition, where companies showcased their latest products and services in power electronics system integration. The exhibition floor buzzed with activity as professionals engaged in specialized discussions, exchanged ideas, and explored innovative solutions. This interactive space served as a nexus for networking, fostering connections between industry leaders, researchers, and enthusiasts.
The meticulous preparation of the event by the volunteer programme committee ensured a seamless experience for attendees, from the state-of-the-art venue to the well-planned schedule. CIPS 2024 not only celebrated the achievements of system integration in power electronics, but also created a platform for knowledge sharing and collaboration that will shape the future of the industry.
